About me: Underfill composite kind of materials is created
using epoxy polymer and filler. The other things
added to the underfill formulation are dyes,
adhesion promoters, and flow agents. Primarily,
the underfills are used for flip-chip kinds of
devices, but they can also be used in other areas.
This includes ball grid arrays, CSPs and BGAs.
https://www.deepmaterialcn.com/best-top-10-bga-und
erfill-epoxy-chip-adhesives-glue-manufacturers-in-
china.html
https://www.pinterest.com/bgaunderfillepoxy/
