About me: DeepMaterial offers new capillary flow underfills
for flip chip, CSP and BGA devices.
DeepMaterial's new capillary flow underfills
are high fluidity, high-purity, one-component
potting materials that form uniform, void-free
underfill layers that improve the reliability and
mechanical properties of components by eliminating
stress caused by solder materials.
https://www.deepmaterialcn.com/epoxy-based-chip-un
derfill.html
