About me:
Electronic products of aerospace and navigation,
motor vehicles, automobiles, outdoor LED lighting,
solar energy and military enterprises with high
reliability requirements, solder ball array
devices (BGA/CSP/WLP/POP) and special devices on
circuit boards are all facing microelectronics.
The trend of miniaturization, and thin PCBs with a
thickness of less than 1.0mm or flexible
high-density assembly substrates, solder joints
between devices and substrates become fragile
under mechanical and thermal stress.
