About me: This product is a one component heat curing epoxy
with good adhesion to a wide range of materials. A
classic underfill adhesive with ultra-low
viscosity suitable for most underfill
applications. The reusable epoxy primer is
designed for CSP and BGA applications.
https://www.epoxyadhesiveglue.com/product/epoxy-un
derfill-chip-level-adhesives/
